Method of applying a treating solution

专利名称：Method of applying a treating solution发明人：Shigemori, Kazuhito,Sanada, Masakazu申请号：EP03004861.5申请日：20030305公开号：EP1372185A3公开日：20070509

专利附图：

摘要：A substrate spinning step is executed for spinning a substrate in a plane parallelto a principal plane thereof at a first spinning speed of 100rpm to 500rpm. Then, a firstapplying step is executed for supplying a treating solution to a surface of the substrateby moving a nozzle from a position opposed to an edge of the substrate in a spin toward

a position opposed to a spin center of the substrate while delivering the treating solutionfrom the nozzle. Next, a second applying step is executed for supplying the treatingsolution to the surface of the substrate by stopping the nozzle at the position opposedto the spin center of the substrate in the spin while delivering the treating solution fromthe nozzle. Finally, a film thickness adjusting step is executed for stopping delivery of thetreating solution from the nozzle, and spinning the substrate in the plane parallel to theprincipal plane thereof at a second spinning speed faster than the first spinning speed.

申请人：Sokudo Co., Ltd.

地址：K-I Shijo Building, 88 Kankoboko-cho Shijodori-Muromachi-Higashiiru Shimogyo-ku Kyoto 600-8009 JP

国籍：JP

代理机构：Goddar, Heinz J.

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