专利名称：SEMICONDUCTOR DEVICE HAVING A BUMP
STRUCTURE AND METHOD FORMANUFACTURING THE SAME
发明人：Chun-Te Lee,Ming-Sheng Liu申请号：US15952807申请日：20180413
公开号：US20190214357A1公开日：20190711
专利附图：
摘要：A method for manufacturing a semiconductor device includes an extra etchingprocess. A bump or a UBM layer is etched additionally in the extra etching process after
forming the semiconductor device such that the semiconductor device can conform tothe standard of performance and appearance.
申请人：CHIPBOND TECHNOLOGY CORPORATION
地址：Hsinchu TW
国籍：TW
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