Multilayer printed wiring board and manufacturing

专利名称：Multilayer printed wiring board and

manufacturing method thereof

发明人：Mori, Yoji,Kawamura, Yoichiro申请号：EP08011580.1申请日：19961219公开号：EP1981317A3公开日：20081029

专利附图：

摘要：A multilayered printed wiring board in which an interlayer insulating layer (134)is formed on a base material (131) on which a lower conductor circuit (132A) is formed, anupper conductor circuit (137) is formed on the interlayer insulating layer and the lower

and upper conductor circuits are electrically connected via plural via holes (136) which arecollectively formed. Preferably, said via holes share their land and the form of said land isany of the shape of a tear, an ellipse and a circle.

申请人：IBIDEN CO., LTD.

地址：1 Kanda-cho 2-chome Ogaki-shi Gifu - ken 503 JP

国籍：JP

代理机构：Nicholls, Michael John

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