专利名称：Reactive fusible glue发明人：Schenkel, Hubert, Dr.申请号：EP89114490.9申请日：19890805公开号：EP0354498A2公开日：19900214
摘要： It describes a reactive hotmelt adhesive containing a resin component at leastone thermally activatable latent hardener for the resin component and optionallyBeschleuninger, fillers, thixotropic auxiliaries and further customary additives. Theadhesive is characterized in that the resin component by reacting , And is availablewherein the epoxy resins a) and b), present in an amount such be used in the
polyoxypropylene having amino end groups, that is an excess of epoxy groups, based onthe amino groups ensured.
申请人：Teroson GmbH
地址：Postfach 10 56 20 D-69046 Heidelberg DE
国籍：DE
代理机构：UEXKÜLL & STOLBERG
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容