IPC-标准的中英文目录

IPC-T-50F IPC-S-100 IPC-E-500 IPC-TM-650 IPC-ESD-20-20 IPC/EIA J-STD-001C IPC-HDBK-001 IPC-A-610C IPC-HDBK-610 IPC-EA-100-K IPC/WHMA-A-620 IPC/EIA J-STD-012 IPC-SM-784 IPC/EIA J-STD-026 J-STD-027 IPC/EIA J-STD-028

Terms and Definition for Interconnecting and Packaging Electronic Circuits

电子电路互连与封装的定义和术语 Standards and Specifications Manual 标准和详细说明汇编手册

IPC Electronic Document Collection

已出版的IPC标准电子文档资料合订本 Test Methods Manual 试验方法手册

Association Standard for the Development of an ESD Control Program

静电释放控制过程(由静电释放协会制定)

Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求

Handbook and Guide to Supplement J-STD-001—Includes Amendment 1

J-STD-001辅助手册及指南及修改说明1 Acceptability of Electronic Assemblies 印制板组装件验收条件

Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison

IPC-610手册和指南(包括IPC-A-610B和C的对比) Electronic Assembly Reference Set

电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

Requirements and Acceptance for Cable and Wire Harness Assemblies

电缆和引线贴装的要求和验收

Implementation of Flip Chip and Chip Scale Technology 倒装芯片及芯片级封装技术的应用

Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则

Semiconductor Design Standard for Flip Chip Applications 倒装芯片用半导体设计标准

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

FC（倒装片）和CSP(芯片级封装)的外形轮廓标准

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

倒装芯片及芯片级凸块结构的性能标准

SMC-WP-003 J-STD-013 IPC-7095 IPC/EIA J-STD-032 IT-98000

IT-98080 IT-98093 IPC-MC-790 IPC-M-108 IPC-TP-1113 IPC-CH-65A IPC-SC-60A IPC-SA-61 IPC-AC-62A IPC-TR-476A

IPC-TR-580 IPC-TR-582

Chip Mounting Technology 芯片贴装技术

Implementation of Ball Grid Array and Other High Density Technology

球栅阵列 (BGA)及其它高密度封装技术的应用

Design and Assembly Process Implementation for BGAs 球栅阵列的设计与组装过程的实施 Performance Standard for Ball Grid Array Balls BGA球形凸点的标准规范

JPL Chip Scale Packaging Guidelines JPL 发布的CSP导则

注：IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory) JPL Ball Grid Array Packaging Guidelines JPL 发布的BGA封装导则

ITRI Chip Carrier, Phase 1 Report ITRI 关于芯片载体的报告

ITRI (The Interconnect Technology Research Institute) Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则

Cleaning Guides and Handbook Manual 清洗导则和手册

Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?

电路板离子洁净度测量：它告诉我们什么？

Guidelines for Cleaning of Printed Boards & Assemblies 印制板及组装件清洗导则

Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册

Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册

Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册

Electrochemical Migration: Electrically Induced Failures in Printed

Circuit Assemblies

电化学迁移：印制电路组件的电气诱发故障

Cleaning and Cleanliness Test Program Phase 1 Test Results 清洗及清洁度试验计划1阶段试验结果

Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究

IPC-TR-583 IPC-9201 IPC-TP-104K

IPC-M-109

IPC/JEDEC J-STD-020B IPC/JEDEC J-STD-033AIPC/JEDEC J-STD-035 IPC-9500-K IPC-DRM-18F IPC-DRM-SMT-C IPC-DRM-40E IPC-DRM-56 IPC-DRM-53 IPC-M-103 IPC-M-104 IPC-TA-722 IPC-TA-723 IPC-TA-724

An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试

Surface Insulation Resistance Handbook 表面绝缘电阻手册

Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,

Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分

Component Handling Manual 元件处理手册

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

非密封固态表面贴装器件湿度／再流焊敏感度分类 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

非气密封装电子元件用声波显微镜 Set of four documents 9501-9504 9501至9504手册合订本

Component Identification Desk Reference Manual 零件分类标识手册

Surface Mount Solder Joint Evaluation Desk Reference Manual 接插件焊接点评价手册

Through-Hole Solder Joint Evaluation Desk Reference Manual 接插件焊接点评价手册

Wire Preparation & Crimping Desk Reference Manual 导线和端子预成形参考手册

Introduction to Electronics Assembly Desk Reference Manual 电子组装基础介绍手册

Standards for Surface Mount Assemblies Manual 所有SMT标准合订本

Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 Technology Assessment of Soldering 锡焊技术精选手册

Technology Assessment Handbook on Surface Mounting 表面安装技术精选手册

Technology Assessment Series on Clean Rooms 清洁室技术精选系列

IPC-SM-780 IPC-SM-785 IPC-PD-335 IPC-7525 IPC-TR-581 IPC-MI-660 IPC/EIA J-STD-004 IPC/EIA J-STD-005 IPC-HDBK-005 IPC/EIA J-STD-006A

IPC-SM-817 IPC-CA-821 IPC-3406 IPC-3408 IPC-CC-830B

IPC-HDBK-830 IPC-SM-840C

Component Packaging and Interconnecting with Emphasis on Surface Mounting

以表面安装为主的元件封装及互连导则

Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

表面安装焊接件加速可靠性试验导则 Electronic Packaging Handbook 电子封装手册 Stencil Design Guidelines 网版设计导则

IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究

Incoming Inspection of Raw Materials Manual 原材料接收检验手册

Requirements for Soldering Fluxes-Includes Amendment 1 锡焊焊剂要求（包括修改单1）

Requirements for Soldering Pastes-Includes Amendment 1 焊膏技术要求（包括修改单1） Guide to Solder Paste Assessment 焊膏性能评价手册

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求

General Requirements for Dielectric Surface Mounting Adhesives

表面安装用介电粘接剂通用要求

General Requirements for Thermally Conductive Adhesives 导热胶粘剂通用要求

Guidelines for Electrically Conductive Surface Mount Adhesives

表面贴装导电胶使用指南

General Requirements for Anisotropically Conductive Adhesives Films

各向异性导电胶膜的一般要求

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册

Guideline for Design, Selection and Application of Conformal Coatings

敷形涂层的设计，选择和应用手册

Qualification and Performance of Permanent Solder Mask - Includes Amendment 1

永久性阻焊剂的鉴定及性能(包括修改单1)

IPC-HDBK-840 IPC-TP-1114 IPC-TR-467 IPC-AJ-820 IPC-7530 IPC-9701

IPC-TP-1090 IPC-TP-1115 IPC-S-816 IPC-TR-460A IPC-CM-770D IPC-7912

IPC-9261 IPC-9501 IPC-9502 IPC-9503 IPC-9504

Guide to Solder Paste Assessment 焊膏性能评价手册

The Layman’s Guide to Qualifying a Process to J-STD-001 基于J-STD-001组装工艺雷氏选择法

Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes)

J-STD-001(焊剂控制)的支持数据及数字实例 Assembly & Joining Handbook 装联手册

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

大规模焊接(回流焊与波峰焊)过程温度曲线指南

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

表面安装锡焊件性能试验方法与鉴定要求 The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法

Selection and Implementation Strategy for a Low-Residue No-Clean Process

低残留不清洗工艺的选择和实施 SMT Process Guideline & Checklist 表面安装技术过程导则及检核表

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards

印制板波峰焊故障排除检查表

Component Mounting Guidelines for Printed Boards 印制板元件安装导则

Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies

印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算

In-Process DPMO and Estimated Yield for PWAs

印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 PWB Assembly Soldering Process Guideline for Electronic Components

电子元件的印制板组装焊接过导则

Moisture Sensitivity Classification for Non-IC Components 非集成电路元件的湿度敏感度分级

Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

非集成电路元件的组装过程模拟评价（非集成电路元件预处理）

IPC-9850-K

IPC-9850-TM-KW, IPC-9850-TM-K

IPC-7711/21 7711 & 7721IPC-7711 IPC-7721

IPC/EIA J-STD-002B IPC/EIA J-STD-003 IPC-TR-461 IPC-TR-462

IPC-TR-4 IPC-TR-465-1 IPC-TR-465-2 IPC-TR-465-3 IPC-TR-466 SMC-WP-001

Surface Mount Placement Equipment Characterization-KIT 表面贴装设备性能检测方法的描述（附Gerber格式CD盘）

Test Materials Kit for Surface Mount Placement Equipment Standardization

表面贴装设备性能测试用的标准工具包

• 4 IPC-9850 Placement Accuracy Verification Panels • 1 IPC-9850 CMM Measurement Verification Panels • 150 IPC-9850 QFP-100 Glass Components • 130 IPC-9850 QFP-208 Glass Components • 150 IPC-9850 BGA-228 Glass Components • NIST Traceable Measurement Certificate • Custom Storage Case Package 合订本

Rework of Electronic Assemblies 电子组装件的返工

Repair and Modification of Printed Boards and Electronic Assemblies

印制板和电子组装件的修复与修正

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

元件引线、端子、焊片、接线柱及导线可焊性试验 Solderability Tests for Printed Boards 印制板可焊性试验

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards

印制板波峰焊故障排除检查表

Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage

带保护性涂层印制板长期贮存的可焊性评价 Accelerated Aging for Solderability Evaluations 可焊性加速老化评价(附修订)

Round Robin Test on Steam Ager Temperature Control Stability 蒸汽老化器温度控制稳定性联合试验

The Effect of Steam Aging Time and Temperature on Solderability Test Results

蒸汽老化时间与温度对可焊性试验结果的影响

Evaluation of Steam Aging on Alternative Finishes, Phase IIA 替代涂覆层的蒸汽老化评价

Technical Report: Wetting Balance Standard Weight Comparison Test

技术报告: 润湿天平称重标准对比测试 Soldering Capability White Paper Report 可焊性工艺导论

SMC-WP-005 更多内容,请浏览

PCB Surface Finishes 印制电路板表面清洗