专利名称：Method of manufacturing IC cards发明人：Susumu Takagi申请号：US09763082申请日：20010216公开号：US06615390B1公开日：20030902
专利附图：
摘要：A IC card producing method includes testing steps which can enhance thereliability and generality of IC cards. The method of producing IC cards of the non-contact type or contact type implements a wafer processing step (step ), wafer
inspection step (step ), COB fabrication step (step ), COB on-card mounting step (step ), IC
card production process 0th-order issuance step (step ), IC card inspection step (step ),1st-order issuance processing step (step ), and 2nd-order issuance processing step (step )to complete a contact-type IC card. Particularly, the method includes the chip testing ofstep and IC card testing of steps for the IC card in its state having a tested chip. Themethod further adopts a dual testing scheme which includes a memory verification testconducted inside the internal memory, such as an EEPROM, concurrently with the IC cardtest by the tester.
申请人：HITACHI, LTD.,HITACHI TOKYO ELECTRONICS CO., LTD.
代理机构：Antonelli, Terry, Stout & Kraus, LLP
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