LAMP 209-3SURSYGW/S530-A3 Features • Two chips are matched for uniform light output, wide viewing angle • Long life-solid state reliability • I.C. compatible/Low power consumption • Pb free • The product itself will remain within RoHS compliant version • Compliance with EU REACH • Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm) Description • The 209-3LED lamp contain two integral chips and is available as both bicolor and bipolar types. • The Brilliant Red and Brilliant Yellow Green light is emitted by diodes of AlGaInP and AlGaInP. • Type of bipolar lamps are both White Diffused and Water Clear while the bicolor are White Diffused. Applications • TV set • Monitor • Telephone • Computer 1 Copyright © 2010, Everlight All Rights Reserved. Release Date : Apr .2 .2014 . Issue No: DLE-0006571_Rev.2 www.everlight.com Device Selection Guide Chip Materials AlGaInP AlGaInP Emitted Color Brilliant Red White Diffused Brilliant Yellow Green Resin Color Absolute Maximum Ratings (Ta=25℃) Parameter Continuous Forward Current Peak Forward Current (Duty 1/10 @ 1KHZ) Symbol IF IFP Rating SUR SYG SUR SYG 5 SUR 60 SYG 60 -40 ~ +85 -40 ~ +100 25 25 60 60 Unit mA mA Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature VR Pd Topr Tstg Tsol V mW ℃ ℃ 260 ℃ for 5 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Forward Voltage Reverse Current Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Symbol VF IR IV 2θ1/2 λp λd △λ Min. 1.7 1.7 ----- ----- 25 10 Typ. 2.0 2.0 ----- ----- 50 20 Max. 2.4 2.4 10 10 ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- Unit V μA Condition IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA SUR SYG SUR SYG SUR SYG SUR SYG SUR SYG SUR SYG SUR SYG mcd deg nm nm nm ---- ---- ---- ---- ---- ---- ---- ----- 80 80 632 575 624 573 20 20 2 www.everlight.com DATASHEET LAMP 209-3SURSYGW/S530-A3 Typical Electro-Optical Characteristics Curves SUR Relative Intensity vs. Wavelength (Ta=25℃) Directivity (Ta=25℃) Relative Intensity (a.u.) Radiation Angle Forward Current vs. Forward Voltage (Ta=25℃) Relative Intensity (a.u.) Wavelength (nm) Relative Intensity vs. Forward Current (Ta=25℃) 1.5Relative Intensity(a.u.) Forward Current (mA) 1.0 0.5 0.00510152025 Forward Voltage (V) Relative Intensity vs. Ambient Temp. Forward Current (mA) Forward Current vs. Ambient Temp. 402.0Relative Intensity (a.u.) Forward Current (mA) 1.530 0.5100.025303540455055606570 0020406080100 Forward Current (mA) Ambient Temperature Ta(℃) 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : Apr .2 .2014 . Issue No: DLE-0006571_Rev.2 www.everlight.com 1.020 DATASHEET LAMP 209-3SURSYGW/S530-A3 SYG Relative Intensity vs. Wavelength (Ta=25℃) Directivity (Ta=25℃) Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25℃) Relative Intensity vs. Forward Current (Ta=25℃) Radiation Angle Relative Intensity (a.u.) Wavelength (nm) 1.5Relative Intensity(a.u.) Forward Current (mA) 1.0 0.50.0 0510152025 Forward Voltage (V) Chromaticity Coordinate vs. Forward Current(Ta=25℃) Forward Current (mA) Forward Current vs. Ambient Temp. 402.0Relative Intensity (a.u.) 1.5Forward Current (mA) 30 0.5100.0250303540455055606570020406080100 Ambient Temperature Ta(℃) Forward Current (mA) 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : Apr .2 .2014 . Issue No: DLE-0006571_Rev.2 www.everlight.com 1.020 Package Dimension 1 1 2 3 2 3 Note: Note: 1. All dimensions are in millimeters 2. The height of flange must be less than 1.5mm(0.059\"). 3. Without special declared, the tolerance is ±0.25mm. 5 DLE-0006571_Rev.2 www.everlight.com Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer’s Production Number PbEVERLIGHTRoHSX209-3SURSYGW/S530-A3 ‧P/N : Production Number ‧QTY: Packing Quantity ‧CAT: Ranks of Luminous Intensity and Forward Voltage ‧HUE: Color Rank ‧REF: VF ‧LOT No: Lot Number Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton Pb■ Packing Quantity 1.500 PCS/1 Bag, 4 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : Apr .2 .2014 . Issue No: DLE-0006571_Rev.2 www.everlight.com Notes 1. Lead Forming During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Lead forming should be done before soldering. Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering 300℃ Max. (30W Max.) Temp. at tip of iron Soldering time 3 sec Max. Distance 3mm Min.(From solder joint to epoxy bulb) Recommended soldering profile DIP Soldering 100℃ Max. (60 sec Max.) Preheat temp. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min. (From solder joint to epoxy bulb) laminar waveFluxingPreheadAvoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Dip and hand soldering should not be done more than one time After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. 7 DLE-0006571_Rev.2 www.everlight.com Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED 5. Heat Management Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification. The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 6. ESD (Electrostatic Discharge) The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials Proper grounding is required for all devices, equipment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers 7. Directions for use The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it may cause migration resulting in LED damage. 8. Other Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. 8 www.everlight.com