专利名称：An electroplating apparatus
发明人：Henington, Paul,Fung, Chun Pan,Li, Kwok
Wah,Lee, Chi Chung
申请号：EP98304973.5申请日：19980624公开号：EP0915189A2公开日：19990512
摘要：An apparatus for electroplating at least one substrate is disclosed as includinga trough, two anodes, at least one bath and two poly-tetrafluoroethylene sheets or anumber of substantially rigid polypropylene plates, in which the trough supports thesubstrate and is in an electrically conductive relationship therewith, and the bath containsthe anodes, the trough and an electrolyte, in which, in operation, an electric field exists inthe electrolyte between the trough and the anodes, and in which the poly-tetrafluoroethylene sheets or the polypropylene plates are movable to vary the amountof electric current passing between the trough and the anodes.
申请人：PROCESS AUTOMATION INTERNATIONAL LIMITED
地址：11 Dai Hei Street, Tai Po Industrial Estate Tai Po, New Territories HK
国籍：HK
代理机构：Findlay, Alice Rosemary
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