专利名称：Via structure
发明人：Azniza Binti Abd Aziz,Chan Kim Lee,Kuen Yew
Lam
申请号：US11524108申请日：20060920
公开号：US20080067665A1公开日：20080320
专利附图：
摘要：In one embodiment, the invention may include a semiconductor packagesubstrate with a plated-through hole (PTH) via. One or more conduits for transmittingsignals can be located in the PTH via. The PTH via may shield the signals in the conduits
from environmental noise (e.g., EMI). Other embodiments are described and claimed.
申请人：Azniza Binti Abd Aziz,Chan Kim Lee,Kuen Yew Lam
地址：Ipoh Perak MY,US,Penang MY
国籍：MY,US,MY
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